Adiuva vos ut confirmetis chip TRADUCTOR dimensionum

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A longitudinem onus sectionem       mmB altitudinem TRADUCTOR CUNICA      mm

C summa missionis sectionem     mm

D longitudinem missionis sectionem     mm

E-altitudinis diverticulum ad sectionem inclinare    mm

F-latitudo TRADUCTOR CUNICA     mm

G altiore TRADUCTOR longitudinem     mm

H altitudo a pavimento usque ad TRADUCTOR

imo     mm

Ego angulus in sectione inclinatio     °

 

Situs coegi dispositionis in sectione missionis in directum ad materiam chip vel chunky portandam in:

eiciam dextrum latus

eiciam sinistram partem

coegi imperium

ONERO custodibus

vicissim switch

subitis-off switch

 

Tooling modi

conversus in torno

Milling

EXERCITATIO

molendum

Alius           

 

Quantum Swarf

        Kg/h         dm³/h

Chip stultum quid "continuus"

Amount of swaff per cycle     kg

 

Swarf material

Steel

ferrum mitte

Aluminium

Brass

Alius            

 

Swarf Special

Brevis eu <8cm

Long eu>8cm

Chip bundle

Chip et pieces

 

Requiritur motricium nexum

3×230V/50Hz/60Hz

3×380V/50Hz/60Hz

3×400V/50Hz/60Hz

3×480V/50Hz/60Hz

 

Praesto potestate voltage of the

Tabula transibit:

□ 110V/AC

24V/DC

Infectum processus: □ Coolant tristique facultatem       L

Moles coolant copia    L/min

 

Genus coolant

Oil         mm²/s@40℃

Emulsion    mm²/s@40℃

 

Coolant exitum

Front

Audi

Lateralis

Utrimque

 

Coolant Pump:

Pump facultatem       L/min

Pump pressura       bar

Pump facultatem       L/min

Pump pressura       bar

 

Alia facultas:

Level switch

Bin full

Bin inanis

Overflow prevents

 

Option:

Chip bin


Post tempus: Mar-09-2022